Theoretical Modeling and Prediction of Delamination in Flip-Chip Assemblies with Nano-filled

Citation: 
Mahalingam, S., Prabhakumar, A., Tonapi, S., and Sitaraman, S. K., "Theoretical Modeling and Prediction of Delamination in Flip-Chip Assemblies with Nano-filled, No-flow Underfill Materials", Transactions of ASME - Journal of Electronic Packaging, Vol. 130, Vol. 4, Dec. 2008, pp. 0410051-0410055.