Electrical/Mechanical Modeling, Reliability Assessment and Fabrication of FlexConnects:

Citation: 
Kacker, K. and Sitaraman, S. K., "Electrical/Mechanical Modeling, Reliability Assessment and Fabrication of FlexConnects: A MEMS based Compliant Chip-to-Substrate Interconnect," IEEE/ASME Journal of Microelectromechanical Systems, Vol. 18, No. 2, April 2009, pp. 322-331.