Use of Stress-Engineered Material Layers for the Measurement of Interfacial Fracture Toughness of Nano-Scale Thin Films

Citation: 
Zheng, J. and Sitaraman, S. K., “Use of Stress-Engineered Material Layers for the Measurement of Interfacial Fracture Toughness of Nano-Scale Thin Films,” International Journal on Materials and Product Technology, Special Issue on Micro/NanoElectronics and NEMS and MEMS Packaging, Vol. 34, No. 1/2, pp. 131-138, 2009.