Predictive Model Development for Life Prediction of PBGA Packages with SnAgCu Solder Joints

Citation: 
Tunga, K. and Sitaraman, S. K., "Predictive Model Development for Life Prediction of PBGA Packages with SnAgCu Solder Joints." IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 1, 2010, pp. 84-93.