Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly

Citation: 
Liu, X., Zheng, J., and Sitaraman, S. K., “Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly,” Transactions of the ASME – Journal of Electronic Packaging, June 2010, Vol. 132, pp. 0210041-0210048.