Reliability Assessment of Through Silicon Vias in Multi-Die Stack Packages

Citation: 
Liu, X, Chen, Q., Sundaram, V., Simmons-Matthews, M., Wachtler, K. P., Tummala, R. R., and Sitaraman, S. K., “Reliability Assessment of Through Silicon Vias in Multi-Die Stack Packages,” IEEE Transactions on Device and Materials Reliability Vol. 12, No. 2, June 2012, pp. 263-271.