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A Comparison of Substrate MAterials in Printed Wiring Boards
1996
Solar Applications/Thin film Interfacial Characterization
2011
Elastic-Plastic Modeling of Plated-Through Holes in Solder Shock Test
1996
Thermo-Mechanical Modeling of Quad-Flat
1997
Cu-Sn-Cu Micro-bump Microstructure Evolution and Reliability Analysis
2012
Process Modeling and Thermal Cycling of Vias
1997
Solar Canopy for Personal Transportation
Spring 2012, Fall 2013
Thermo-Mechanical Reliability of Microelectronic Packages and Probes
2000
CASPaR Development
1997
Complaint Interconnects
2010
Thermo-Mechanical Reliability of Plated-Through-Hole/Press-Pin Assemblies
2001
Mechanical Characterization of Compliant Interconnects
2013
Virtual Reality and its Applications in the Design and Manufacturing Process
1995
Lead Free Solder Alloy Microstructure Evolution
2010
Solar Applications
2012
Solar Harvesting for Open Environment
2013
Thermo-Mechanical Behavior of Flip-Chip Assembly
1997
SOLAR Prototyping
2010
Interfacial Strength Measurement through Magnetic Actuation
2010
Thermo-Mechanical Modeling and Experiments for Microelectronic Packaging Reliability
2000
Mechanical Characterization of Electroplated Copper Micro-scale Thin Films
2013
Solder Joint Crack Analysis
2007
Solar-Assisted Tricycle
2011
Thermal Characteristics of Off-Chip Compliant Interconnects
2013
CASPaR Development
1998
Study of Inter-facial Delamination in Copper/Epoxy Mold Compound interface
2014
Design and Fabrication of Microelectronic Packaging
2009
Thermo-Mechanical Analysis of Flip-Chips with Solder Voids
1997
Cu/FR4 Delamination
Mold Compound Delamination
Solar-Assisted Tricycle
2011