Study of intermetallic growth and kinetics in fine-pitch lead-free solder bumps for next-generation flip-chip assemblies

Citation: 
Tian, Y., Chow, J., Liu, X., Wu, Y.P., and Sitaraman, S.K., "Study of intermetallic growth and kinetics in fine-pitch lead-free solder bumps for next-generation flip-chip assemblies," Journal of Electronic Materials, Vol. 42, pp. 230-239, February 2013.