Thermomechanical Strain Measurement by Synchrotron X-ray Diffraction and Data Interpretation for Through-Silicon Vias

Citation: 
Liu, X., Thadesar, P. A., Taylor, C. L., Kunz, M., Tamura, N., Bakir, M. S., and Sitaraman, S. K., "Thermomechanical Strain Measurement by Synchrotron X-ray Diffraction and Data Interpretation for Through-Silicon Vias," Applied Physics Letters, Vol.103, p.022107, 2013.