Dimension and Liner Dependent Thermomechanical Strain Characterization of Through-Silicon Vias using Synchrotron X-ray Diffraction

Citation: 
Liu, X., Thadesar, P. A., Taylor, C. L., Kunz, M., Tamura, N., Bakir, M. S., and Sitaraman, S. K., "Dimension and Liner Dependent Thermomechanical Strain Characterization of Through-Silicon Vias using Synchrotron X-ray Diffraction," Journal of Applied Physics, Vol. 114, p. 064908, 2013.
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