Packaging, Reliability, and Manufacturing Issues Associated with Electronic and Photonic Products

Citation: 
Ume, I. C., Lau, J., Suhir, E., Kowalski, G., Sitaraman, S., Ramakrishna, K., Sammakia, K., and Kao, I. (editors), Packaging, Reliability, and Manufacturing Issues Associated with Electronic and Photonic Products, EPP-Vol. 1, ASME, 2001.