Thermo-Mechanical Reliability Prediction for Lead-Free Solder Interconnects

Citation: 
Sitaraman, S. K. and Kacker, K., “Thermo-Mechanical Reliability Prediction for Lead-Free Solder Interconnects,” Chapter 8, Lead-Free Solder Interconnect Reliability, Ed. D. Shangguan, EDFAS (Electronic Device Failure Analysis Society) and ASM International, 2005.