Mechanically Compliant I/O Interconnects and Packaging

Citation: 
Sitaraman, S. K. and Kacker, K., “Mechanically Compliant I/O Interconnects and Packaging,” Chapter 3, Integrated Interconnect Technologies for 3D Nanoelectronic Systems, Ed. Muhannad S. Bakir and James D. Meindl, Artech House, 2009.
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