Cu/Low-K Interface Adhesion Enhancement Through Nano-Colonies of Adhesive Materials

Provisional Patent, "Cu/Low-K Interface Adhesion Enhancement Through Nano-Colonies of Adhesive Materials," J. Zheng, R. Pucha, and S. K. Sitaraman, Filed in July 2004, Based on Invention Disclosure GTRC ID 3234.

type: 
Provisional Patent
Year: 
2 004