Trench-via Shape Design of On-Chip Interconnect with Cu/Low-K Patent

Provisional Patent, “Trench-via Shape Design of On-Chip Interconnect with Cu/Low-K,” J. Zheng, R. Pucha, and S. K. Sitaraman, Filed in July 2004, Based on Invention Disclosure GTRC ID 3219.

type: 
Provisional Patent
Year: 
2 004