ECTC/Other

  1. Tian, Y., Liu, X., Chow, J., Wu, Y. P., and Sitaraman, S. K., “Comparison of IMC Growth in Flip-Chip Assemblies with 100- and 200-µm-Pitch SAC305 Solder Joints,” 63rdElectronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, May 2013, pp. 1005-1009.

  2. Chen, W., Bhat, A., and Sitaraman, S. K., “Use of Compliant Interconnects for Drop Impact Isolation,” 63rdElectronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, May 2013, pp. 835-839.

  3. Okereke, R. and Sitaraman, S. K., “Three-Path Electroplated Copper Compliant Interconnects: Fabrication and Modeling Studies,” 63rd Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, May 2013, pp. 129-135.

  4. Xu, J., Razeeb, K. M., Sitaraman, S. K., and Mathewson, A., “The Fabrication of Ultra Long Metal Nanowire Bumps and their Application as Interconnects,” 12th IEEE International Conference on Nanotechnology (IEEE-NANO), Birmingham, UK, August 2012.

  5. Taylor, C. and Sitaraman S.K.,"In-situ strain measurement with metallic thin film sensors," 62nd Electronic Components and Technology Conference, p. 641-646,2012
  6. Liu, X., Li, M., Mullen, D., Cline, J., and Sitaraman, S.K.,"Design and assembly of double-sided 3D package with a controller and a DRAM stack," 62nd Electronic Components and Technology Conference,1205-1212,2012
  7. Raghavan, S., Schmadlak, I., and Sitaraman, S.K., "Interlayer dielectric cracking in back end of line (BEOL) stack," 62nd Electronic Components and Technology Conference, p.1467-1474,2012
  8. Lee, R.E., Okereke, R., and Sitaraman, S.K., "Multi-path fan shaped compliant off-chip interconnects," 61st Electronic Components and Technology Conference, p 2141-2145, 2011
  9. Liu, X., Chen, Q., Sundaram,V. Simmons-Matthews, M., Wachltier, K.P., Tummala, R.R., and Sitaraman, S.K., "Thermo-mechanical behavior of through silicon vias in a 3D integrated package with inter-chip microbumps," 61st Electronic Components and Technology Conference, p 1190-1195, 2011
  10. Liu, X., Chen, Q., Dixit, P., Chatterjee, R., Tummala, R. R., and Sitaraman, S. K., "Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)," 59th Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, May 2009, pp. 624-629.
  11. Zheng, G., Ostrowicki, G., and Sitaraman, S.K., "Non Contact Magnetic Actuation Test Technique to Characterize Interfactial Fatigue Fracture of Thin Films," Proceedings - Electronic Components and Technology Conference , p 1368-1373, 2009, 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC.
  12. Xi Liu, Qiao Chen, Dixit, P., Chatterjee, R., Rao, R T., and Sitaraman, S.K., "Failure Mechanism and Optimum Design for Electroplated Copper Through Silicon Vias (TSV)," Proceedings - Electronic Components and Technology Conference, p 624-629, 2009, 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC.
  13. Perkins, Andy and Sitaraman, S.K., "A study into the sequencing of thermal cycling and vibration tests," Proceedings - Electronic Components and Technology Conference , p 584-592, 2008, 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC.
  14. McCaslin, Luke and Sitaraman S.K., "Methodology for modeling substrate warpage using copper trace pattern implementation," Proceedings - Electronic Components and Technology Conference , p 1582-1586, 2008, 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC.
  15. Zheng, J., Modi, M., Ginga, N., and Sitaraman, S., "Silicon, Low-K Dielectric, and Nano-Scale Metal Interface Characterization using Stress-Engineered Superlayer Test Methods," 57th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Reno, NV, May 2007, pp. 1384-1389.
  16. Kacker, K., Sokol, T., and Sitaraman, S. K., "FlexConnects: A Cost-Effective Implementation of Compliant Chip-to-Substrate Interconnects," 57th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Reno, NV, May 2007, pp. 1678-1684.
  17. Kim, I., Pucha, R. V., Peak, R. S., and Sitaraman, S. K., "System-Design-for-Reliability Tools for Highly Integrated Electronic Packaging Systems," 57th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Reno, NV, May 2007, pp. 1809-1814.
  18. Kumbhat, N., Raj, P. M., Pucha, R. V., Sundaram, V., Bongio, E., Sitaraman, S., and Tummala, R. R., "A Novel Low CTE, High Stiffness Ceramic Composite Core," Circuits Assembly, January 2007, p. 28.
  19. Zheng, J. and Sitaraman, S. K., "Fixtureless Superlayer-Driven Decohesion Test for Interfacial Fracture Toughness Measurement of Nano-Scale Thin Films," Thin Films and Intefaces-4, International Conference on Advanced Materials Design and Development, Goa, India, Dec. 2005.
  20. Lee, K.J., Pucha, R., Varadarajan, M., Bhattacharya, S., Tummala, R., and Sitaraman, S.K., "Reliability Assessment of Embedded Capacitors in Multilayered Microvia Organic Substrate," IMAPS 2005, Philadelphia, PA, Sep. 2005.
  21. Perkins, A. and Sitaraman, S. K., "Acceleration Factor to Relate Thermal Cycles to Power Cycles for Ceramic Area Array Packages," 2005 Surface Mount Technology Association International (SMTAI) Conference Proceedings, Chicago, Sep. 2005.
  22. Kacker, K., Lo, G., and Sitaraman, S. K., "Assembly and Reliability Assessment of Lithography-Based Wafer-Level Compliant Chip-to-Substrate Interconnects," 55th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Orlando, FL, May 2005, pp. 545-550.
  23. Klein, K.M., Zheng, J., Gewirtz, A., Sarma, D. S. R., Rajalakshmi, S., and Sitaraman, S.K., "Array of Nano-Cantilevers as a Bio-Assay for Cancer Diagnosis," ," 55th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Orlando, FL, May 2005, pp. 583-587.
  24. Kumbhat, N., Raj, P. M., Pucha, R. V., Atmur, S., Doraiswamy, R., Sundaram, V., Bhattacharya, S., Sitaraman, S.K., and Tummala, R. "Recent Advances in Composite Substrate Materials for High-Density and High-Reliability Packaging Applications," ," 55th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Orlando, FL, May 2005, pp. 1364-1372.
  25. Zheng, J., Klein, K.M., Pucha, R., Sitaraman, S.V . , Merlin, D., Rajalakshmi, S., Sarma, D. S. R., Gewirtz, A. and Sitaraman, S.K., "Nano-Cantilevers for an Ultra-Sensitive Bio-Assay," Proceedings of NSTI Nanotechnology Conf. and Trade Show, Vol. 1 Chapter 8: Bio Micro Sensors, May 2005, pp. 406-409.
  26. Lee, K.J., Bhattacharya, S., Varadarajan, M., Wan, L., Abothu, I.R., Sundaram, V., Muthana, P., Balaraman, D., Raj, P.M., Swaminathan, M., Sitaraman, S.K. and Tummala, R.R., "Design, Fabrication, and Reliability Assessment of Embedded Resistors and Capacitors on Multilayered Microvia Organic Substrates," Proceedings of the IEEE-CPMT International Symposium and Exhibition on Advanced Packaging Materials, Irvine, CA, pp. 249-254, March 16-18, 2005.
  27. Damani, M., Pucha, R.V., Bhattacharya, S., Tummala, R., and Sitaraman, S.K., "Physics-based Reliability Assessment of Embedded Passives," 54th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, June 2004, pp. 2027-2031
  28. Kumbhat, N., Raj, P.M., Pucha, R.V., Sundaram, V., Doraiswami, R., Bhattacharya, S., Hayes, S., Atmur, S., Sitaraman, S.K., and Tummala, R., "Next Generation of Package/Board Materials Technology for Ultra-High Density Wiring and Fine-Pitch Reliable Interconnection Assembly," 54th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, June 2004, pp. 1843-1850
  29. Mahalingam, S., Hegde, S., Ahmad, J., Pucha, R.V., Sundaram, V., Liu, F., White, G., Tummala, R., and Sitaraman, S.K., "Materials, Processes and Reliability of Mixed-Signal Substrates for SOP Technology," 54th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, June 2004, pp. 1630-1635
  30. Tunga, K., Kacker, K., Pucha, R.V., and Sitaraman, S.K., "Accelerated Thermal Cycling: Is it Different for Lead-free Solder?," 54th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, June 2004, pp. 1579-1585
  31. Kim, W., Madhavan, R., Mao, J., Choi, J., Choi, S., Ravi, D., Sundaram, V., Sankararaman, S. , Gupta, P., Zhang, Z., Lo, G., Swaminathan, M., Tummala, R., Sitaraman, S.K., Wong, C.P., Lyer, G., Rotaru, G., and Tay, A., "Effect of Wafer Level Packaging, Silicon Substrate and Board Material on Gigabit Board-Silicon-Board Data Transmission," 54th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, June 2004, pp. 1506-1512
  32. Perkins, A., and Sitaraman, S.K., "Vibration-Induced Solder Joint Failure of a Ceramic Column Grid Array (CCGA) Package," 54th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, June 2004, pp. 1271-1278
  33. Hegde, S., Pucha, R.V., Guidotti, D., Liu, F., Chang, Y.J., Tummala, R., Chang, G. and Sitaraman, S. K., "Design, Fabrication, and Reliability Testing of Embedded Optical Interconnects on Package," 54th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, June 2004, pp. 895-900
  34. Zhang, Z., Fan, L., Sitaraman, S. K., and Wong, C.P. "Four-Laser Bending Beam Measurements and FEM Modeling of Underfill Induced Wafer Warpage,"54th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, June 2004, pp. 747-753
  35. Lo, G. and Sitaraman, S. K., "G-Helix: Lithography-Based Wafer-Level Compliant Chip-to-Substrate Interconnects," 54th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, June 2004, pp. 320-325
  36. Zheng, J. and Sitaraman, S. K., "In-Process Measurement of the Interfacial Fracture Toughness for a Sub-micron Titanium Thin Film and Silicon Interface using a Single-Strip Decohesion Test," 54th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, June 2004, pp. 134-139.
  37. N. Kumbhat, P. Markondeya Raj, S. Hegde, R.V. Pucha, V. Sundaram, S. Hayes, S. Atmur, S. Bhattacharya, S.K. Sitaraman, and R.R. Tummala, "Novel Board Material Technology for Next-Generation Microelectronic Packaging" in Developments in Dielectric Materials and Electronic Devices, Ceramic Transactions (K.M.Nair et al, Editors), Vol.167, 2004, pp. 371-382.
  38. Modi, M. and Sitaraman, S. K., "Single-Substrate Decohesion Test for Interfacial Fracture Toughness Measurement," EPTC 2003, 5th Electronics Packaging Technology Conference, Proceedings EPTC 2003, 5th Electronics Packaging Technology Conference, IEEE-CPMT and IMAPS, Dec. 10-12, 2003, Singapore, pp. 456-461.
  39. Classe, F. and Sitaraman, S. K., "Asymmetric Accelerated Thermal Cycles: An Alternative Approach to Accelerated Reliability Assessment of Microelectronic Packages," Proceedings EPTC 2003, 5th Electronics Packaging Technology Conference, IEEE-CPMT and IMAPS, Dec. 10-12, 2003, Singapore, pp. 81-89.
  40. Kim, W, Madhavan, R., Mao, J., Choi, J., Choi, S., Ravi, D., Sundaram, V., Sankararaman, S., Gupta, P., Zhang, Z., Lo, G., Swaminathan, M., Tummala, R. R., Sitaraman, S., Wong, C. P., Iyer, M. K., Rotaru, M., and Tay, A. A. O., "Electrical Design of Wafer Level Package on Board for Gigabit Data Transmission," Proceedings EPTC 2003, 5th Electronics Packaging Technology Conference, IEEE-CPMT and IMAPS, Dec. 10-12, 2003, Singapore, pp. 150-159.
  41. Perkins, A.and Sitaraman, S.K. "Thermo-Mechanical Failure Comparison and Evaluation of CCGA and CBGA Electronic Packages," 53rd Electronic Components and Technology Conference, IEEE-CPMT and EIA, New Orleans, LA, May 2003, pp. 422-430.
  42. Tunga, K., Pyland, J., Pucha, R. V., and Sitaraman, S.K. "Field-Use Conditions Vs. Thermal Cycles - A Physics-Based Mapping Study," 53rd Electronic Components and Technology Conference, IEEE-CPMT and EIA, New Orleans, LA, May 2003, pp. 182-188.
  43. Zhang, Z., Vorakunpinij, A., Sitaraman, S.K., and Wong, C. P., "Time Evolution of Temperature Distribution of a Flip-Chip No-Flow Underfill Package during Solder Reflow Process ," 53rd Electronic Components and Technology Conference, IEEE-CPMT and EIA, New Orleans, LA, May 2003, pp. 443-451.
  44. Ramakrishna, G., Liu , F., and Sitaraman, S.K. "Role of Substrate and Dielectric Materials on the Thermo mechanical Reliability of Microvias," 52nd Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, May 2002, pp. 439-445.
  45. Hegde, S., Pucha, R.V., and Sitaraman, S.K. "Selection of Optimal Materials and Geometry for Reliability of High Density Wiring (HDW) Substrates," 52nd Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, May 2002, pp. 446-451.
  46. Modi, M. and Sitaraman, S.K. "Effect of Adhesive Layer Properties on Interfacial Fracture in Thin Film High Density Interconnects," 52nd Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, May 2002, pp. 847-853.
  47. Zhu, Q., Ma, L. and Sitaraman, S.K. "Design and Optimization of a Novel Compliant Off-Chip Interconnect - One-Turn Helix," 52nd Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, May 2002, pp. 910-914.
  48. Hu, H. and Sitaraman, S.K. " Optimal Design of an Integrated Substrate Based On the Analysis of Warpage and Delamination," 52nd Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, May 2002, pp. 941-946.
  49. Ramakrishna, G., Pucha, R.V., and Sitaraman, S.K. " Micro-scale Plasticity Effects in Microvia Reliability Analysis," 52nd Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, May 2002, pp. 1304-1309.
  50. Ma, L., Qi, Z., Hantschel, T., Fork, D. K., and Sitaraman, S.K. "J-Springs - Innovative Compliant Interconnects for Next-Generation Packaging," 52nd Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, May 2002, pp. 1359-1365.
  51. Ahmad, J. and Sitaraman, S. K., "Modeling Methodologies to Study PWB Assembly Reliability," 52nd Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, May 2002, pp. 1658-1664.
  52. Zhu, Q., Ma, L., and Sitaraman, S. K. "Lithography-Based One-Turn Helix (OTH) Compliant Interconnects for Wafer Level Packaging," International Workshop On Wafer Level CSP and Flip Chip Packaging, Stone Mountain, GA, March 2002.
  53. Pyland, J., Pucha, R.V., and Sitaraman, S. K., "Effect of Underfill on BGA Reliability," 51st Electronic Components and Technology Conference, IEEE-CPMT and EIA, Orlando, FL, May 2001, pp. 85-90
  54. Ahmad, M. and Sitaraman, S. K., "Coupled Thermal Electric Modeling of Flexible Micro-Spring Interconnects for High Performance Probing," 51st Electronic Components and Technology Conference, IEEE-CPMT and EIA, Orlando, FL, May 2001, pp. 721-729.
  55. Xie, W., Hu, H., and Sitaraman, S. K., "Selection of Base Substrate Material for Design Against Interfacial Delamination for a Multilayered SOP Structure," 51st Electronic Components and Technology Conference, IEEE-CPMT and EIA, Orlando, FL, May 2001, pp. 613-619.
  56. Ma, L., Zhu, Q., Sitaraman, S. K., Chua, C., and Fork, D., "Compliant cantilevered spring interconnects for flip-chip packaging," 51st Electronic Components and Technology Conference, IEEE-CPMT and EIA, Orlando, FL, May 2001, pp. 761-766.
  57. Fork, D. K., Chua, C. L., Wong, L., Alimonda, A. S., Smith, D. L., Modi, M., Zhu, Q., Ma, L., and Sitaraman, S. K., "Stress-engineered metal interconnects", Proceeding of 2001 International Conference on High-Density Interconnect and System Packaging, Santa Clara, CA, USA, April, 2001.
  58. Ma, L., Zhu, Q., Sitaraman, S. K., Chua, C., and Fork D. K., "Novel Nanospring Interconnects for High-Density Applications," 7th International Symposium and Exhibition on Advanced Packaging Materials - Processes, Properties, and Interfaces, IMAPS-IEEE, Braselton, GA, March 2001, pp. 372-378.
  59. Sitaraman, S. K., Dunne, R. C., Raghunathan, R., and Xie, W., "Implantable Medical Devices and Next-Genertion Microsystems Packaging: An Integrated Process Modeling Approach to High Reliability and Miniaturization," NSF Design and Manufacturing Grantees Conference, Tampa, FL, Jan. 7-10, 2001.
  60. Chua, C. L., Fork, D. K., Smith, D. L., McIntyre, H., Ma, L., Zhu, Q., Modi, M. and Sitaraman, S. K., "High density packaging of vertical-cavity surface-emitting laser arrays using micro-machined spring arrays", Proceedings of IEEE Lasers and Electro-Optics Society (LEOS) 2000 Annual Meeting, Rio Grande, Puerto Rico, November 2000.
  61. Bhattacharya, S., Baldwin, D., Sitaraman, S., Qu, J., Wong, C. P., Ume, I. C., and Tummala, R. R., "Low Cost MCM: Large Area Packaging using Small Area Substrates, Part 2," High-Density Interconnect International, October 2000, pp. 36-39.
  62. Bhattacharya, S., Baldwin, D., Sitaraman, S., Qu, J., Wong, C. P., Ume, I. C., and Tummala, R. R., "Low Cost MCM: Large Area Packaging using Small Area Substrates, Part 1," High-Density Interconnect International, September, 2000, pp. 20-25.
  63. Schubert, A., Dudek, R., Leutenbauer, R., Coskina, P., Becker, K. -F., Kloeser, H., Reichl, D., Baldwin, D., Qu, J., Swaminathan, M., Wong, C. P., Tummala, R., and Sitaraman, S. K., "Numerical and Experimental Investigation of Large IC Flip Chip Attach," 50th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, May 2000, pp. 1338-1346.
  64. Haemer, J. M., Sitaraman, S. K., Fork, D. K., Smith, D., Mok, S., and Chong, F. C., "Flexible Micro-Spring Interconnects for High Performance Probing," 50th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, May 2000, pp. 1157-1163.
  65. Paydenkar, C. S., Baldwin, D. F., Sitaraman, S., Wong, C. P., and Lewis, B. J., "Chip Scale Polymer Stud Grid Array Packaging and Reliability Based on Low Cost Flip-Chip Processing," 50th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, May 2000, pp. 1449-1459.
  66. Hu, H., Xie, W., and Sitaraman , S. K., "Analytical Model to Study Interfacial Delamination Propagation in a Multi-Layered Electronic Packaging Structure under Thermal Loading," 50th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, May 2000, pp. 1526-1534.
  67. Dunne, R. C., Sitaraman, S. K., Luo, S., Wong, C. P., Estes, W. E., and Periyasamy, M., "Cure Kinetics Modeling of ViaLux 81: A Novel Epoxy Photo-Dielectric Film (PDDF) for Microvia Applications," 6th International Symposium and Exhibition on Advanced Packaging Materials - Processes, Properties, and Interfaces, IMAPS-IEEE, Braselton, GA, March 2000, pp. 254-260.
  68. Sitaraman, S. K., Dunne, R. C., Hanna, C. E., Michaelides, S., Raghunathan, R., and Xie, W., "An Integrated Process-Mechanics and Reliability Prediction Methodology for Implantable Medical Devices," NSF Design and Manufacturing Grantees Conference, Vancouver, BC, Canada, Jan. 4-6, 2000.
  69. Dunne, R. C., Sitaraman, S. K., Rao, Y., Luo, S., Wong, C. P., Estes, W. E., Gonzalez, C. G., Murray, E. B., Overcash, T. R., Anderson, R. E., Coburn, J. C., and Periyasamy, M., "Cure Optimization and Process Guidelines for a Novel Epoxy Photo-Dielectric Dry Film for Microvia Applications," 8th Electronic Circuits World Convention, Tokyo, September 1999.
  70. Hanna, C., Michaelides, S., Palaniappan, P., Baldwin, D., and Sitaraman, S. K., "Numerical and Experimental Study of the Evolution of Stresses in Flip-Chip Assemblies during Assembly and Thermal Cycling," 49th Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, June 1999, pp. 1001-1009.
  71. Variyam, M. and Sitaraman, S. K., "Palletized Approach to Large-Area Thin-Film Processing - Materials, Models, and Measurement," 49th Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, June 1999, pp. 686-693.
  72. Manjula, S., Sundararaman, V., Sitaraman, S. K., Wong, C. P., Wu, J., and Pike, R. T., "Multi-Layered Structure: Adhesive Selection and Process Mechanics," 5th International Symposium and Exhibition on Advanced Packaging Materials - Processes, Properties, and Interfaces, IMAPS-IEEE, Braselton, GA, March 1999, pp. 48-52.
  73. Sitaraman, S. K., "Implantable Medical Devices: A Process-Modeling Approach to High Reliability and Miniaturization," NSF Design and Manufacturing Grantees Conference, Long Beach, CA, Jan. 5-8, 1999.
  74. Dunne, R. C. and Sitaraman, S. K., "Process Modeling of Sequential Build-Up of Multilayered Structures," 48th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Seattle, WA, May 1998, pp. 353-361.
  75. Sitaraman, S. K., Sundararaman, V., Manjula, S., Wong, C. P., Lu, D., Pike, R. T., Meyers, L., "Use of Highly Compliant Adhesives in the Large Area Processing of MCM-D Substrates," 48th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Seattle, WA, May 1998, pp. 895-899.
  76. Pang, H. L. J., Tan, T., and Sitaraman, S. K. "Thermo-Mechanical Analysis of Solder Joint Fatigue and Creep in a Flip Chip on Board Package Subjected to Temperature Cycling Loading," 48th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Seattle, WA, May 1998, pp. 878-883.
  77. Dunne, R. C. and Sitaraman, S. K., "Sequential Process Modeling of SLIM Substrate Fabrication," 4th International Symposium and Exhibition on Advanced Packaging Materials - Processes, Properties, and Interfaces, IMAPS-IEEE, Braselton, GA, March 1998, pp. 175-182.
  78. Pang, H. L. J., Sitaraman, S. K., Zwemer, D. A., and Hassell, P., "Thermally-Induced Warpage and Stresses in Flip-Chip on Board (FCOB) Assembly", 2nd International Advanced Technology Workshop on Flip Chip Technology, IMAPS-IEEE, March 14-16, 1998, Braselton, GA.
  79. Ramani, K. and Sitaraman, S. K., "Dissimilar Material Systems: Manufacturing Processes, Design, and Mechanics," MD-Vol. 80, Composites and Functionally Graded Materials, ASME 1997, p. 277.
  80. Tummala, R., Swaminathan, M., and Sitaraman, S. K., Next-Generation Package Design, IMAPS Advanced Technology Workshop, June 1997.
  81. Murphy, R. S. and Sitaraman, S. K., "Two and Three-Dimensional Modeling of VSPA Butt Solder Joints", 47th Electronic Components and Technology Conference, IEEE and EIA, San Jose, CA, May 18-21, 1997, pp. 472-478.
  82. Dunne, R. C. and Sitaraman, S. K., "The Effect of Substrate Materials on the Thermal Mechanical Behavior of Multilayer Structures, 3rd International Symposium and Exhibition on Advanced Packaging Materials - Processes, Properties, and Interfaces, IMAPS-IEEE, Braselton, GA, March 9-12, 1997, pp. 134-137.
  83. Dunne, R. C. and Sitaraman, S. K.,"Thermo-Mechanical Reliability of a 'Sandwich' Substrate with Integrated Passives", VIII International Congress on Experimental Mechanics and Experimental/Numerical Mechanics in Electronics Packaging, Nashville, TN, June 10-13, 1996, pp. 19-20.
  84. Michaelides, S., and Sitaraman, S. K.,"Micro-Macro-Micro Modeling in Electronic Packaging," Experimental/Numerical Mechanics in Electronic Packaging, VIII International Congress on Experimental Mechanics, June 10-13, 1996, Nashville, TN, pp. 44-45.
  85. Dunne, R. C. and Sitaraman, S. K., "Thermo-Mechanical Modeling of a Novel MCM-DL Technology," 46th Electronic Components and Technology Conference, IEEE and EIA, Orlando, Florida, May 1996, pp. 815-820.
  86. Michaelides, S., and Sitaraman, S. K. ,"Thermo-Mechanical Design of Flip-Chip for Harsh Environments," ISHM International Conference and Exhibition on Multichip Modules, April 17-19, 1996, Denver, CO, pp. 155-160.