Awards

Awards

Department of Mechanical and Aerospace Enginering, The Ohio state University, 2012

American Society of Mechancial Engineers Electronic and Photonic Packaging Division, 2012

Sigma Xi, Georgia Institute of Technology, 2008

Embedded Passives in Organic Structures:IEEE Transactions on Components and Packaging Technologies, March 2007. Lee, K. J., Damani, M., Pucha, R., Bhattacharya, S., Tummala, R., and Sitaraman, S. K., "Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates," IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 1, 2007, pp. 152-162.

Georgia Institute of Technology, 2006

Suresh K. Sitaraman, Ph.D., 2004

IEEE Transactions on Advanced Packaging, “The SOP for Miniaturized, Mixed-Signal Computing, Communication, and Consumer Systems of the Next Decade,” R. R. Tummala, M. Swaminathan, M. M. Tentzeris, J. Laskar, G. K. Chung, S. Sitaraman, et al., May 2004

Selected by the Board of Engineering Education, ASME, Fall 2003-Present.

May 2003. Zhu, Q., Ma, L., and Sitaraman, S. K., “Design Optimization of One-Turn Helix - a Novel Compliant Off-Chip Interconnect,” IEEE Transactions on Advanced Packaging, Vol. 26, No. 2, May 2003, pp. 106-112.

"Interfacial Fracture Toughness for Delamination Growth Prediction in a Novel Peripheral Array Package," V. Sundararaman and S. K. Sitaraman

International Symposium and Exhibition on Advanced Packaging Materials, IMAPS, March 2000, “Cure Kinetics Modeling of ViaLux 81: A Novel Epoxy Photo-Dielectric Film (PDDF) for Microvia Applications,” by Dunne, R. C., Sitaraman, S. K., Luo, S., Wong, C. P., Estes, W. E., and Periyasamy, M.

"Development of Virtual Reliability Methodology for Area-Array Devices used in Implantable and Automotive Applications," S. Sitaraman, R. Raghunathan, and C. E. Hanna, 2000

Suresh K. Sitaraman, Ph.D., 1999. Please see http://www.whistle.gatech.edu/archives/99/march/1

5th International Symposium and Exhibition on Advanced Packaging Materials - Processes, Properties, and Interfaces, IMAPS, March 1999, “Multi-Layered Structure: Adhesive Selection and Process Mechanics,” Manjula, S., Sundararaman, V., Sitaraman, S. K., Wong, C. P., Wu, J., and Pike, R. T.

NSF Packaging Research Center – 1998

Suresh K. Sitaraman, Ph.D., 1997-2002

Student Awards and Honors

First Place, Student Poster Competition, Glass Interposer Technology 2013 Workshop

Scott McCann

November 2013, Atlanta, Georgia; for the poster titled, “Fabrication Process and Modeling of Glass Interposers for Warpage Study,” by Scott McCann and Suresh K. Sitaraman

Third Place, Student Poster Competition, Glass Interposer Technology 2012 Workshop

Xi Liu and Christine Taylor

November 2012, Atlanta, Georgia; for the poster titled, “Three-Dimensional Stacked Dies with Through Silicon Vias: In-situ Stress Characterization and Thermo-Mechanical Reliability Assessment,” by Xi Liu, Christine Taylor, and Suresh K. Sitaraman

Sigma Xi, Best Doctoral Thesis Award, 2012

Gregory Ostrowicki

Intel Best Student Paper at 62nd ECTC

Sathyanarayanan Raghavan

Interlayer Dielectric Cracking in Back End of Line (BEOL) Stack by Sathyanarayanan Raghavan – Georgia Institute of Technology; Ilko Schmadlak – Freescale Semiconductor; and Suresh K. Sitaraman

First Place, Student Poster Competition, Glass Interposer Technology 2012 Workshop

Raphael Okereke

November 2012, Atlanta, Georgia; for the poster titled, “Mechanically Compliant Single-Path and Multi-Path Electrical Interconnects,” by Okereke, Bhat, Lee, Kacker, Lo, Xu, Zhu, and Suresh K. Sitaraman

First Place, Student Poster Competition, The Electronic and Photonic Packaging Division, ASME IMECE2010

Raphael Okereke

ASME 2010 International Mechanical Engineering Congress and Exposition (IMECE2010), November 2010, Vancouver, British Columbia, Canada; for the poster titled, “Parallel-Path Compliant Structures as Electrical Interconnects,” by Raphael Okereke, Karan Kacker, and Suresh K. Sitaraman

Second Place, Student Poster Competition, The Electronic and Photonic Packaging Division, ASME 2010 IMECE2010

Gregory Ostrowicki

ASME 2010 International Mechanical Engineering Congress and Exposition (IMECE2010), November 2010, Vancouver, British Columbia, Canada; for the poster titled, “Magnetically Actuated Peel Test for Interfacial Fracture and Fatigue Characterization,” by Greg Ostrowicki and Suresh K. Sitaraman.

Sam Nunn Security Program Fellow

Kevin Klein, Georgia Institute of Technology, 2006

Atlanta Surface Mount Technology Association (SMTA) Scholarship winner

Andrew Perkins, 2005 

Atlanta Surface Mount Technology Association (SMTA) Scholarship winner

Shashi Hegde, 2005

Sigma Xi, Best Doctoral Thesis Award, 2004

Qi Zhu, 2004

SMTA Hutchins Grant

Andrew Perkins, 2003

First Place, Student Poster Competition, PRC/NSF, Fall 2003

George Lo, Qi Zhu, et al.

‘Compliant Interconnects,’ PRC/NSF, Fall 2003

Third Place, Student Poster Competition, PRC/NSF, Fall 2003

S. Hegde, et a.

‘Optoelectronic Reliability,’ , PRC/NSF, Fall 2003

IMAPS Educational Foundation Scholarship

James Pyland, 2000-2001

Presidential Fellowship

A. Perkins, Fall 2000 - 2004

IMAPS Educational Foundation Scholarship

Joe Haemer, 1999-2000

Presidential Fellowship

M. Modi, Fall 1999-2003

Outstanding Poster Award (Undergraduate) - First Place - IAB/NSF Site Visit

C. Johnson O

Thermo-Mechanical Reliability of Vias - IAB/NSF Site Visit, Oct. 1997

Onassis Foundation Scholarship

S. Michaelides, 1997-1999

Outstanding Poster Award (Graduate/ART) - Second Place - IAB/NSF Site Visit

R. Dunne
Thermo-Mechanical Modeling of SLIM, IAB/NSF Site Visit, Oct. 1997

Sigma Xi Undergraduate Research Award

Jill Conley

“Elastic-Plastic Modeling of Plated-Through Holes in Solder Shock Test.”  1996

Leventis Foundation Scholarship

S. Michaelides PhD Student, 1995-1997