Visiting Scholars Alumni
School of Materials and Engineering, Jiujiang University
Spring 2016
Norwegian University of Science and Technology
Fall 2001 and Spring 2002
Interfacial delamination of thin film materials
Department of Precision Instruments and Mechanology
Tsinghua University,
P. R. China
Fall 2011 – Fall 2012
Microelectronic Packaging Reliability – Interfacial Delamination and DIC
Assistant Professor,
Department of Mechanical Engineering
Indian Institute of Technology, Hyderabad, India
May 2011 – July 2011
School of Mechanical Engineering, Hubei University of Technology, China
Spring 2015
School of Mechanical and Production Engineering
Nanyang Technological University, Singapore
Summer and Fall 1997
Digital Image Correlation
Associate Professor in Physics from Department of Optics, Universidad Complutense, Madrid Spain
Fall 2012 – Spring 2013
School of materials science and Engineering, Chongqing University,
China
2015
Investigation and prediction of Sn-Ag-Cu solder joint reliability, School of Material Science
Hua Zhong University of Science and Technology, China
Fall 2010 – Fall 2012