Undergraduate Alumni
Solar Applications/Thin film Interfacial Characterization
2011
Elastic-Plastic Modeling of Plated-Through Holes in Solder Shock Test
1996
Thermo-Mechanical Modeling of Quad-Flat
1997
Thermo-Mechanical Reliability of Microelectronic Packages and Probes
2000
Complaint Interconnects
2010
Thermo-Mechanical Reliability of Plated-Through-Hole/Press-Pin Assemblies
2001
Mechanical Characterization of Compliant Interconnects
2013
Thermo-Mechanical Modeling and Experiments for Microelectronic Packaging Reliability
2000
2015
2016
Study of Inter-facial Delamination in Copper/Epoxy Mold Compound interface
2014
Cu/FR4 Delamination
Mold Compound Delamination
Solar-Assisted Tricycle
2011
Anthony Belvin
A Comparison of Substrate MAterials in Printed Wiring Boards
1996
Ellis Galyon
Jack Jacoby
Yunji Gu
Cu-Sn-Cu Micro-bump Microstructure Evolution and Reliability Analysis
2012
Caliph Johnson
Process Modeling and Thermal Cycling of Vias
1997
Jin Woo Kim
Solar Canopy for Personal Transportation
Spring 2012, Fall 2013
Mark Lawson
CASPaR Development
1997
Marcial Machado
Virtual Reality and its Applications in the Design and Manufacturing Process
1995
Rahul Mathew
Lead Free Solder Alloy Microstructure Evolution
2010
Jason Munger
Solar Applications
2012
Dhruv Nair
Solar Harvesting for Open Environment
2013
Brian O’Hara
Thermo-Mechanical Behavior of Flip-Chip Assembly
1997
Albert Oyegun
SOLAR Prototyping
2010
John W. Payne
Interfacial Strength Measurement through Magnetic Actuation
2010
Sai Lohith Gali Ramesh
Mechanical Characterization of Electroplated Copper Micro-scale Thin Films
2013
Sidharth Shah
Solder Joint Crack Analysis
2007
Patrick Smith
Solar-Assisted Tricycle
2011
Yaqin Song
Thermal Characteristics of Off-Chip Compliant Interconnects
2013
Meera Srinivasan
CASPaR Development
1998
Diego Torres
Design and Fabrication of Microelectronic Packaging
2009
Jason Tsai
Thermo-Mechanical Analysis of Flip-Chips with Solder Voids
1997