- Chen, W., Chung, P. Y., and Sitaraman, S. K., “Mechanical Reliability Assessment of 3-Arc-Fan Compliant Interconnects,” Chapter 2, Volume 3: Flexible Chip I/O Interconnects, Set 1: Interconnect and Wafer Bonding Technology, Encyclopedia of Packaging Materials, Processes, and Mechanics, Oct. 2019, World Scientific Publishing.
- Muhannad S. Bakir and Suresh K. Sitaraman, Volume 3: Flexible Chip I/O Interconnects, Set 1: Interconnect and Wafer Bonding Technology, Encyclopedia of Packaging Materials, Processes, and Mechanics, Oct. 2019, World Scientific Publishing.
- Chung, P. Y., Chen, W., and Sitaraman, S. K., “Design, Fabrication, and Assembly of 3-Arc-Fan Compliant Interconnects,” Chapter 1, Volume 3: Flexible Chip I/O Interconnects, Set 1: Interconnect and Wafer Bonding Technology, Encyclopedia of Packaging Materials, Processes, and Mechanics, Oct. 2019, World Scientific Publishing.
- Ma, L., Sitaraman, S. K., Zhu, Q., Klein, K., and Fork, D., “Design and Development of Stress-Engineered Compliant Interconnect in Microelectronic Packaging,” Chapter 28, Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition, Ed. James E. Morris, Springer, 2018.
- Sitaraman, S. K. and Kacker, K., “Mechanically Compliant I/O Interconnects and Packaging,” Chapter 3, Integrated Interconnect Technologies for 3D Nanoelectronic Systems, Ed. Muhannad S. Bakir and James D. Meindl, Artech House, 2009.
- Ma, L., Sitaraman, S. K., Zhu, Q., Klein, K., and Fork, D., “Design and Development of Stress-Engineered Compliant Interconnect in Microelectronic Packaging,” Chapter 21, Nanopackaging: Nanotechnologies and Electronics Packaging, Ed. James E. Morris and Debendra Malik, Springer, 2008.
- Perkins, A. E. and Sitaraman, S. K., Solder Joint Reliability Prediction for Multiple Environments, Springer, ISBN 978-0-387-79393-1, 2008.
- Pucha, R. V., Qu, J.,and Sitaraman, S. K., “Mixed Signal Package Reliability,” Chapter 8, Introduction to System on Package (SOP), R. R. Tummala and M. Swaminathan, McGraw-Hill, 2008.
- Sitaraman, S. K. and Kacker, K., “Thermo-Mechanical Reliability Prediction for Lead-Free Solder Interconnects,” Chapter 8, Lead-Free Solder Interconnect Reliability, Ed. D. Shangguan, EDFAS (Electronic Device Failure Analysis Society) and ASM International, 2005.
- Zheng, J. and Sitaraman, S. K., “Development of Single-Strip Decohesion Test to Measure Interfacial Fracture Toughness,” pp. 226-235, The World of Electronic Packaging and System Integration, Ed. B. Michel and R. Aschenbrenner, ddp goldenbogen, 2004.
- Ume, I. C., Lau, J., Suhir, E., Kowalski, G., Sitaraman, S., Ramakrishna, K., Sammakia, K., and Kao, I. (editors), Packaging, Reliability, and Manufacturing Issues Associated with Electronic and Photonic Products, EPP-Vol. 1, ASME, 2001.
- Sitaraman, S. K. and Pang, J., “Fundamentals of Design for Reliability,” Chapter 5, Fundamentals of Microsystems Packaging, R. Tummala, McGraw-Hill, 2001.
- Ahmad, M. and Sitaraman, S. K., “Coupled Thermal Electric Modeling of Flexible Micro-Spring Interconnects for High Performance Probing,” 51st Electronic Components and Technology Conference, IEEE-CPMT and EIA, Orlando, FL, May 2001, pp. 721-729.
- Srivatson, T. S., Jones, W., Zavaliangas, A., Ramani, K., Jacob, K. I., Sitaraman, S. K., Katsube, N., and Yang, S.(editors), Composites and Functionally Graded Materials, MD-Vol. 80, ASME 1997.