Current PhD Students

Electroplated Nanowires as Thermal Interface Material

Study of Delamination of Bimaterials Under the Influence of Different Modes of Loading

Mechanical Reliability and Characterization of Stretchable and Wearable Electronics

Flip-chip Reliability Through Experimental Measurement

Thermomechanical Reliability of Microfluidic Channels
Rui Chen
Alumni PhD:

Compliant Interconnects
2015

Thermo-Mechanical Reliability of a substrate with Integrated Passives
2000

Stress-engineered Superlayer for Fracture Studies
2014

Investigation of Optical Changes in Siloxane Polymer Waveguides During Thermal Curing and Aging
2008

Design and Fabrication of Free-Standing Structures as Off-Chip Interconnects
2008

Development of a Knowledge Model for the Computer-Aided Design for Reliability of Electronic Packaging Systems
2008

Experimental and Theoretical Assessment of Through-Silicon Vias for 3D Integrated Microelectronic Packages
2013

Thermo-Mechanical Reliability of High Density Stress-Engineered Compliant Interconnects for Electronic Packaging Application
2003

Study of Interfacial Crack Propogation in Flip Chip Assemblies with Nano-filled Underfill Materials
2005

Glass Interposer Cracking
2017

Physics-Based Process Modeling, Reliability Prediction and Design Guidelines for Flip-Chip Devices
1999

Fracture in Stress Engineered High Density Thin Film Interconnects
2003

Electroplated multi-path compliant copper interconnects for flip-chip packages
2014

Magnetic Actuation for Fatigue Interfacial Delamination
2012

Investigation and Prediction of Solder Joint Reliability for Ceramic Area Array Packages under Thermal Cycling, Power Cycling, and Vibration Environments
2007

Multilayer Substrate Warpage and Underbump Delamination
2014

Copper-Epoxy Mold Compound Fatigue

Study of SnAgCu Alloy Reliability though Material Microstructure Evolution and Laser Moire Interferomety
2008

Thermo-Mechanical Evaluation of Interfacial Integrity in Multilayered Microelectronic Packages
2001

Knowledge-Based FEA Modeling for Highly-Coupled Variabel Topology Multi-Body Problems
2004

Interfacial Fracture of Micro thin Film Interconnects under Monotonic and Cyclic Loading
2008

Helix-Type Compliant Off-Chip Interconnects for Microelectronic Packaging
2003