Thermo-Mechanical Modeling of a Novel MCM-DL Technology
Submitted by Caspar_admin on Fri, 01/03/2014 - 22:07Citation:
Dunne, R. C. and Sitaraman, S. K., “Thermo-Mechanical Modeling of a Novel MCM-DL Technology,” 46th Electronic Components and Technology Conference, IEEE and EIA, Orlando, Florida, May 1996, pp. 815-820.