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Home
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Publications
» Patents
Patents
Provisional Patents
Variable Interconnect Geometry with Optimal Electrical and Mechanical Properties for Electronic Packages Patent
Micro and Nano-Cantilever Array with Integrated Piezoresistive Material for Biochemical Assay Patent
“Nano-Scaled Stress-Engineered Biochemical Assay Patent
Fixtureless non-contact fatigue testing for nano-scale thin films using electromagnetism method
Three-Mask Lithography-Based Compliant Interconnects Patent
Trench-via Shape Design of On-Chip Interconnect with Cu/Low-K Patent
Cu/Low-K Interface Adhesion Enhancement Through Nano-Colonies of Adhesive Materials
Modified Decohesion Test for the Measurement of the Mode-Mixity Dependent Interfacial Fracture Toughness
Utility Patents
Compliant Off-Chip Interconnects for Use in Electronic Packages and Fabrication Methods
Compliant Off-Chip Interconnects for use in Electronic Packages
Multi-Axis Compliance Spring Patent
Complaint Off-Chip interconnects Patent
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