Nanopackaging: Nanotechnologies and Electronics Packaging,

Citation: 
Ma, L., Sitaraman, S. K., Zhu, Q., Klein, K., and Fork, D., “Design and Development of Stress-Engineered Compliant Interconnect in Microelectronic Packaging,” Chapter 28, Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition, Ed. James E. Morris, Springer, 2018.