Cure Kinetics Modeling of ViaLux 81: A Novel Epoxy Photo-Dielectric Film (PDDF) for Microvia Applications

Citation: 
Dunne, R. C., Sitaraman, S. K., Luo, S., Wong, C. P., Estes, W. E., and Periyasamy, M., “Cure Kinetics Modeling of ViaLux 81: A Novel Epoxy Photo-Dielectric Film (PDDF) for Microvia Applications,” 6th International Symposium and Exhibition on Advanced Packaging Materials - Processes, Properties, and Interfaces, IMAPS-IEEE, Braselton, GA, March 2000, pp. 254-260.