Analytical Model to Study Interfacial Delamination Propagation in a Multi-Layered Electronic Packaging Structure under Thermal Loading

Citation: 
Hu, H., Xie, W., and Sitaraman, S. K., “Analytical Model to Study Interfacial Delamination Propagation in a Multi-Layered Electronic Packaging Structure under Thermal Loading,” 50th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, May 2000, pp. 1526-1534.