Lithography-Based One-Turn Helix (OTH) Compliant Interconnects for Wafer Level Packaging

Citation: 
Zhu, Q., Ma, L., and Sitaraman, S. K. “Lithography-Based One-Turn Helix (OTH) Compliant Interconnects for Wafer Level Packaging,” International Workshop On Wafer Level CSP and Flip Chip Packaging, Stone Mountain, GA, March 2002