Asymmetric Accelerated Thermal Cycles: An Alternative Approach to Accelerated Reliability Assessment of Microelectronic Packages

Citation: 
Classe, F. and Sitaraman, S. K., “Asymmetric Accelerated Thermal Cycles: An Alternative Approach to Accelerated Reliability Assessment of Microelectronic Packages,” Proceedings of EPTC 2003, 5th Electronics Packaging Technology Conference, IEEE-CPMT and IMAPS, Dec. 10-12, 2003, Singapore, pp. 81-89.