Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures

Citation: 
Xie, W. and Sitaraman, S. K., “Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures,” Transactions of the ASME - Journal of Electronic Packaging, Vol. 122, March 2000, pp. 61-66.