ole of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

Citation: 
Variyam, M., Xie, W., and Sitaraman, S. K., “Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling,” Transactions of the ASME - Journal of Electronic Packaging, Vol. 122, June 2000, pp. 121-127.