Enhanced Reliability of High Density Wiring (HDW) Substrates through New Base Substrate and Dielectric Materials

Citation: 
Hegde, S., Pucha, R. and Sitaraman, S. K., “Enhanced Reliability of High Density Wiring (HDW) Substrates through New Base Substrate and Dielectric Materials," Journal of Material Science: Materials in Electronics Vol. 15, Issue 5, May 2004, pp. 287-296.