Printed circuit board (PCB) miniaturization by embedded passives and sequential build-up (SBU) process methodology

Citation: 
Varadharajan, M. G., Lee, K. J., Bhattacharya, S. K., Pucha, R., Tummala, R. R., and Sitaraman, S., ”Printed circuit board (PCB) miniaturization by embedded passives and sequential build-up (SBU) process methodology,” Journal of Indian Institute Science, Nov.-Dec. 2006, Vol. 86, pp. 639-654.