Methodology to Predict Substrate Warpage and Different Techniques to Achieve Substrate Warpage Targets

Citation: 
Raghavan, S., Klein, K., Yoon, S., Kim, J.-D., Moon, K.-S., Wong, C. P., and Sitaraman, S. K., “Methodology to Predict Substrate Warpage and Different Techniques to Achieve Substrate Warpage Targets ,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 1, No. 7, July 2011, pp. 1064-1074.