IMAPS Best Paper of the Session

International Symposium and Exhibition on Advanced Packaging Materials, IMAPS, March 2000, “Cure Kinetics Modeling of ViaLux 81: A Novel Epoxy Photo-Dielectric Film (PDDF) for Microvia Applications,” by Dunne, R. C., Sitaraman, S. K., Luo, S., Wong, C. P., Estes, W. E., and Periyasamy, M.

type: 
Award
Year: 
2 000